AMD Ryzen 9 7900X3D 4.4GHz Up to 5.6GHz Socket AM5 Processor 100-100000909WOF

SKU: AMD RYZEN 9 7900X3D Boxed
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30,690.00 Original price was: ₱30,690.00.27,900.00Current price is: ₱27,900.00.
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SKU: AMD RYZEN 9 7900X3D Boxed Categories: , Tag:
  • High-performance 12-core processor with 24 threads and up to 5.6GHz boost clock
  • Designed for enthusiast desktops with AMD’s cutting-edge “Zen 4” architecture
  • Supports DDR5 memory, PCIe® 5.0, and advanced overclocking features
  • Massive 128MB L3 cache for enhanced performance in gaming and productivity
  • Integrated Radeon™ Graphics and support for AM5 motherboards

Description

The AMD Ryzen 9 7900X3D is a high-performance enthusiast desktop processor designed for those who demand top-tier computing power. Built on AMD’s “Zen 4” architecture and featuring 12 CPU cores and 24 threads, this processor delivers unmatched speed and efficiency for both gaming and productivity tasks. With a max boost clock of up to 5.6GHz and a massive 128MB L3 cache, the Ryzen 9 7900X3D excels in delivering smooth and responsive performance in the most demanding applications.

This processor is ideal for gamers, content creators, and professionals who require a powerful and versatile system. It supports DDR5 memory, PCIe® 5.0, and includes advanced features like Precision Boost Overdrive and AMD EXPO™ Memory Overclocking Technology. With integrated Radeon™ Graphics and support for AM5 motherboards, the AMD Ryzen 9 7900X3D is the perfect solution for anyone seeking a powerful, future-proof system.

AMD Ryzen 9 7900X3D 4.4GHz Up to 5.6GHz Socket AM5 Processor 100-100000909WOF

SpecificationValue
PlatformDesktop
Market SegmentEnthusiast Desktop
Product FamilyAMD Ryzen™ Processors
Product LineAMD Ryzen™ 9 Processors
Former Codename“Raphael AM5”
Architecture“Zen 4”
Number of CPU Cores12
Multithreading (SMT)Yes
Number of Threads24
Max. Boost ClockUp to 5.6GHz
Base Clock4.4GHz
L1 Cache768KB
L2 Cache12MB
L3 Cache128MB
Default TDP120W
Processor Technology for CPU CoresTSMC 5nm FinFET
Processor Technology for I/O DieTSMC 6nm FinFET
CPU Compute Die (CCD) Size71mm²
I/O Die (IOD) Size122mm²
Package Die Count3
AMD EXPO™ Memory Overclocking TechnologyYes
Precision Boost OverdriveYes
Curve Optimizer Voltage OffsetsYes
CPU SocketAM5
Supporting ChipsetsA620, X670E, X670, B650E, B650
CPU Boost TechnologyPrecision Boost 2
Instruction Setx86-64
Supported ExtensionsAES, AMD-V, AVX, AVX2, AVX512, FMA3, MMX(+), SHA, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSE4A, SSSE3, x86-64
Thermal Solution (PIB)Not included
Recommended CoolerLiquid cooler recommended for optimal performance
Max. Operating Temperature (Tjmax)89°C
Launch Date2/28/2023

Additional information

Weight0.5 kg
Dimensions15 × 14 × 9 cm
Socket

AM5 CPU

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