DeepCool CH260 Micro-ATX High Airflow Mesh Case Tempered Glass Black - R-CH260-BKNGM0-G-1
DeepCool CH260 Micro-ATX High Airflow Mesh Case Tempered Glass Black – R-CH260-BKNGM0-G-1

Original price was: ₱3,910.00.Current price is: ₱3,400.00.

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DeepCool CH260 Micro-ATX High Airflow Mesh Case Tempered Glass Black – R-CH260-BKNGM0-G-1

Original price was: ₱3,910.00.Current price is: ₱3,400.00.

  • Expanded M-ATX Support: Evolution of the CH160 with compatibility for Micro-ATX motherboards and rear-connector designs.
  • Elite Thermal Performance: Wraparound high-airflow mesh panels supporting up to six 120mm fans.
  • Massive Radiator Compatibility: Supports up to a 360mm AIO liquid cooler on the top panel for extreme overclocking.
  • Full-Sized GPU Ready: Accommodates graphics cards up to 388mm (or 413mm without front fans).
  • Extreme Air Cooling: Clearance for high-tower CPU coolers up to 174mm in height.
  • PIXEL Customization: Perforated panels compatible with PIXEL rubber bits for personalized design.
  • Modern Connectivity: Features USB 3.2 Gen2 Type-C, dual USB 3.0, and hybrid audio front I/O.
  • Simplified Maintenance: Includes three removable dust filters and tool-free front panel access.
  • Cable Management: Expansive 29.6mm backplane clearance for tidy builds.
  • SKU: R-CH260-BKNGM0-G-1

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Current: ₱3,400.00 | 90-Day Low: ₱3,400.00 | 90-Day High: ₱3,400.00
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SKU: R-CH260-BKNGM0-G-1 Categories: , Tag:

Level Up to Micro-ATX with the DeepCool CH260

The DeepCool CH260 represents a natural evolution in small form factor design, expanding upon the legendary high-airflow foundation of the classic CH160 ITX case. While maintaining a compact and manageable exterior footprint, the CH260 steps up the versatility by offering full compatibility for Micro-ATX motherboards. This case is the ideal solution for builders who desire the space-saving benefits of a smaller system without sacrificing the expansion possibilities and hardware compatibility typically reserved for much larger mid-tower chassis.

Modern Aesthetic and PIXEL Customization

Visual appeal meets functional design with a full-sized tempered glass side panel that provides a crystal-clear window into your high-end internal components. The CH260 isn’t just a container for your hardware; it is a canvas for personalization. The perforated front and top panels are specifically designed to be compatible with DeepCool PIXEL rubber bits, allowing you to create custom patterns, logos, or accents that make your build truly unique. The sleek black finish and wraparound mesh panels ensure that the case looks as cool as it performs in any professional or gaming environment.

Ready for the Next Generation of Motherboards

As motherboard technology evolves, so does the CH260. This case is fully prepared for the latest trend of rear-connector motherboards, which move cable headers to the back of the PCB for a cleaner internal look. To accommodate this, DeepCool has engineered an expansive 29.6mm clearance in the backplane, providing ample room for cable management and connector access. This forward-thinking design ensures that your build remains tidy and future-proof, supporting a wide range of Micro-ATX and Mini-ITX boards with ease.

Full-Size Power in a Compact Frame

Don’t let the small dimensions fool you; the interior of the CH260 is designed for massive power. Builders can install full-size graphics cards up to 388mm in length, and for those pushing the limits, removing the front fans extends that clearance to a staggering 413mm. Thermal management is equally impressive, with support for high tower CPU air coolers up to 174mm or a massive 360mm All-In-One (AIO) liquid cooler on the top panel. This uncompromised ventilation layout ensures that even the most heat-intensive components receive a steady stream of cool air through the wraparound steel mesh.

Enhanced Building and I/O Experience

The DeepCool CH260 is built by enthusiasts, for enthusiasts. It features tool-free access to the front panel for quick adjustments and maintenance. The front I/O is fully modernized, offering a high-speed USB 3.2 Gen2 Type-C port alongside dual USB 3.0 ports and a hybrid audio jack. To keep your system running cleanly, three removable dust filters are strategically placed throughout the chassis. With a removable ATX PSU mounting bracket and four reusable PCI-e baffles, every step of the building process is streamlined to ensure a premium experience from start to finish.

DeepCool CH260 Micro-ATX High Airflow Case Specifications
Product Identification
BrandDeepCool
Product NameCH260
Part Number (P/N)R-CH260-BKNGM0-G-1
EAN Barcode6933412765233
ColorBlack
Physical Specifications
Product Dimensions438mm × 225mm × 312.5mm (L×W×H)
Net Weight5.3 Kg
MaterialsABS Plastic, SPCC Steel, and Tempered Glass Side Panel
Panel FeaturesWraparound Steel Mesh; PIXEL Rubber Bit compatible perforated front and top
Motherboard & Expansion
Motherboard SupportMini-ITX / Micro-ATX
Full Support for Rear Connector Motherboards
Backplane Clearance29.6mm for advanced cable management
Expansion Slots4 Slots (Independent and reusable PCI-e baffles)
3.5" Drive Bays1
2.5" Drive Bays1
Cooling & Thermal Solutions
Fan SupportFront: 2 × 120mm
Top: 3 × 120mm or 2 × 140mm
Rear: 1 × 120mm
Radiator SupportTop: 120 / 240 / 360mm
Rear: 120mm
CPU Cooler Limit174mm (Supports high tower heat sinks)
Hardware Clearances
GPU Length Limit388mm (with front fans installed)
413mm (without front fans)
Power Supply TypeATX PS2 (Maximum Length: 150mm)
PSU MountingRemovable mounting bracket for simplified cable management
I/O Ports & Features
Front I/O Panel2 × USB 3.0, 1 × USB 3.2 Gen2 Type-C, 1 × Audio/Mic Combo Jack
Dust Filtration3 Removable dust filters (Top, Bottom, Front)
Installation ConvenienceTool-free access to front panel
Weight5.3 kg
Dimensions44 × 23 × 32 cm
Brand

DeepCool

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