Thermal Grizzly Putty Advance High Performance Electrically Non-Conductive Thermal Putty Gap Filler 30g – TG-P-A-030-R
Original price was: ₱1,550.00.₱1,350.00Current price is: ₱1,350.00.
- High-Performance Thermal Gap Filler: Optimized alternative to traditional thermal pads for GPU VRAM and VRM cooling.
- Stepless Height Compensation: Malleable material effectively fills gaps from 0.2 mm up to 3.0 mm.
- Electrically Non-Conductive: Completely safe for all sensitive electronics with zero risk of electrical short-circuits.
- Advance Tier Conductivity: Engineered for good thermal transfer, surpassing the performance of standard factory pads.
- Versatile Application: Perfect for GPU liquid cooling conversions and custom modifications.
- Broad Operating Temperature: Reliable performance ranging from -40 °C to +120 °C.
- Professional Kit: Includes 30g of blue thermal putty and three specialized application spatulas.
- Manufacturer SKU: TG-P-A-030-R
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The Ultimate High-Performance Gap Filler for Enthusiast Builds
The Thermal Grizzly Putty Advance is a revolutionary thermal interface material designed to replace traditional thermal pads in the most demanding electronic environments. Engineered as an electrically non-conductive alternative, this high-performance putty is specifically optimized for high-end graphics card modifications and liquid cooling conversions. Unlike standard pads that come in rigid, fixed thicknesses, TG Putty Advance is a malleable gap filler that adapts perfectly to the unique topography of your PCB, ensuring maximum contact and heat dissipation for voltage regulators and memory modules alike.
Superior Flexibility for Complex Hardware Modifications
Modern graphics cards often utilize multiple thermal pad thicknesses—ranging from 0.5mm to 2.5mm or more—on a single board. Managing these various sizes during a cooler swap or water block installation can be a logistical nightmare. Thermal Grizzly Putty Advance eliminates this complexity by offering a stepless compensation range from 0.2mm up to 3.0mm. Its highly flexible nature allows it to be squeezed and molded to the exact requirements of each component, filling microscopic voids and compensating for height variances that rigid pads simply cannot address. This ensures a uniform thermal bridge between the PCB and the heatsink, regardless of manufacturing tolerances.
High Thermal Conductivity Tier: The Advance Advantage
Positioned as the balanced high-performance choice within the Thermal Grizzly lineup, the “Advance” variant offers significantly improved thermal conductivity over the Basic tier. It is specifically formulated for high-heat components such as VRAM (Video RAM) and VRM (Voltage Regulator Modules) found on flagship GPUs like the NVIDIA RTX 40-series and AMD Radeon RX 7000-series. By providing a more efficient thermal path than many factory-installed pads, it helps prevent thermal throttling on memory-heavy workloads, ensuring your hardware remains stable during competitive gaming or intensive 2026-gen creative renders.
Safety, Safety, and Professional Application
Safety is paramount when working with high-value PC components. TG Putty Advance is completely electrically non-conductive, meaning there is zero risk of short-circuits even if the material overlaps onto surface-mounted capacitors or electrical traces. Each 30-gram jar is supplied with three specialized spatulas designed for large-area application, allowing for a professional, even coat across memory banks or power phases. For enthusiasts in the Philippines building budget gaming PCs or high-end workstations, this putty provides the peace of mind that their hardware is protected and cooled by the industry’s highest standards.
Reliable Yield for Modern Flagship Graphics Cards
Understanding the volume requirements of modern hardware is essential for a successful build. A single 30-gram container of Thermal Grizzly Putty Advance is typically sufficient to cover the entire front-facing VRAM and VRM layout of a standard graphics card. For extreme builds involving active backplates or large gaps between the PCB and the metal back-shroud (such as on the GeForce RTX 4090), utilizing two containers ensures a completely filled thermal interface on both sides of the board. This versatile yield makes it a staple for system integrators and professional modders who demand consistent results across every project.
| Thermal Grizzly Putty Advance 30g – Technical Specifications | |
|---|---|
| General Information | |
| Manufacturer | Thermal Grizzly |
| Product Name | Putty Advance |
| Manufacturer SKU | TG-P-A-030-R |
| TIM Type | Thermal Putty / Gap Filler |
| Performance & Characteristics | |
| Thermal Conductivity Tier | "Advance" Level – High-performance thermal conductivity designed for VRAM and VRM. |
| Electrical Conductivity | Electrically Non-Conductive (Safe for use on sensitive PC components) |
| Operating Temperature | -40 °C to +120 °C |
| Gap Filling Range | Compensates for height differences from 0.2 mm to 3.0 mm. |
| Physical Characteristics | |
| Color | Blue |
| Net Weight | 30 Grams |
| Application Consistency | Highly flexible, malleable, and easy to apply using included spatulas. |
| Application & Usage Guidelines | |
| Primary Application | GPU Modifications, VRAM (Video Memory), and VRM (Voltage Regulator Modules). Ideal as a replacement for standard thermal pads. |
| Estimated Yield | Small GPU (e.g., GTX 1060): Approx. 1 container (30g). Large GPU (e.g., RTX 4090): Approx. 1 container for front-side VRAM/VRM; 2 containers for full PCB/Backplate gap filling. |
| Safety Note | NOT SUITABLE for use on CPU Integrated Heat Spreaders (IHS), Direct Die CPU applications, or directly on the GPU silicon die. |
| Surface Preparation | Requires thorough cleaning and degreasing (isopropanol recommended) prior to application. |
| Package Contents | |
| Thermal Interface | 1x Thermal Putty Advance (30g Jar) |
| Tools | 3x Application Spatulas |
| Packaging Weight | 0.2 kg |
|---|---|
| Packaging Dimensions (L×W×H) | 9 × 8 × 5 cm |
| Brand | Thermal Grizzly |
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