Thermal Grizzly Putty Pro 30g High Performance Electrically Non-Conductive Thermal Gap Filler – TG-P-P-030-R
Original price was: ₱2,580.00.₱2,250.00Current price is: ₱2,250.00.
- Top-Tier Thermal Performance: Pro variant offering “very good” thermal conductivity for maximum heat dissipation.
- Flexible Gap Filler: Malleable putty consistency easily compensates for varying height differences between components.
- Universal Compatibility: Replaces traditional thermal pads of any thickness (0.5mm to 3.0mm+) on GPUs.
- Electrically Non-Conductive: Completely safe to use around sensitive PCB components with zero risk of shorts.
- High Yield Container: 30g content is sufficient for front-side cooling on flagship GPUs like the RTX 4090.
- Ideal for Water Cooling: Simplifies the installation of GPU water blocks by eliminating pad-thickness guesswork.
- Professional Maintenance: Helps lower VRAM and VRM temperatures for improved system stability.
- SKU: TG-P-P-030-R | EAN: 4260711991189
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Premium High-Conductivity Thermal Interface Solution
The Thermal Grizzly Putty Pro 30g is the ultimate high-performance alternative to traditional thermal pads, specifically engineered for the most demanding GPU modifications and custom cooling solutions. As the flagship variant in the Thermal Grizzly Putty lineup, the Pro version delivers “very good” thermal conductivity, surpassing the capabilities of standard gap fillers. This malleable compound is designed for enthusiasts and professionals who need to maximize heat transfer between secondary PCB components—such as VRAM and VRMs—and the cooler, ensuring rock-solid stability during intensive 4K gaming or heavy creative workloads.
Universal Gap Filling and Stepless Height Compensation
Modern graphics cards often feature a complex array of components with varying heights, requiring builders to maintain a stock of multiple thermal pad thicknesses ranging from 0.5mm to 3.0mm. The TG Putty Pro eliminates this complexity by acting as a universal, flexible gap filler. Its soft, dough-like consistency allows it to be molded into any shape or thickness, automatically compensating for height differences across the PCB. This ensure perfect contact pressure and a seamless thermal bridge without the risk of PCB bending or poor contact that can occur when using incorrectly sized pre-cut pads.
Engineered for Flagship GPUs and Water Cooling Conversions
Whether you are performing a liquid cooling conversion on a GeForce RTX 4090 or simply repasting a high-end workstation card, the Putty Pro provides the necessary volume and performance for extreme hardware. For larger flagship cards, a single 30-gram container provides ample coverage for the critical front-side components, including Video Memory and Voltage Regulators. Its ability to fill larger, uniform gaps between the PCB and backplates makes it an essential tool for thermal enthusiasts aiming to reduce hotspot temperatures and improve the overall thermal longevity of their high-value hardware.
Safety-First Non-Conductive Formula
Reliability and safety are at the core of the Thermal Grizzly philosophy. The Putty Pro is entirely electrically non-conductive, providing total peace of mind for DIY builders. There is zero risk of electrical short circuits even if the material overlaps onto surface-mounted capacitors or electrical traces surrounding the memory chips. This makes it an incredibly forgiving material for large-area application compared to liquid metal or certain metallic thermal pastes. When combined with thorough surface preparation using isopropanol, the Putty Pro establishes a high-performance thermal bond that remains stable across thousands of thermal cycles.
Professional Grade Maintenance and Modifications
Designed to support the longevity of your hardware, TG Putty Pro is the ideal choice for those looking to maintain their systems in peak 2026-gen condition. While it is incredibly powerful for VRAM and VRM cooling, it is important to follow professional guidelines: this putty is strictly for secondary components and should never be used on the primary CPU/GPU silicon die. By replacing factory pads with Putty Pro, users can often achieve more consistent thermal results, lower fan speeds, and a quieter computing environment, making it a critical upgrade for any serious PC enthusiast.
| Thermal Grizzly Putty Pro 30g – High-Performance Thermal Interface Specifications | |
|---|---|
| Core Identification | |
| Brand | Thermal Grizzly |
| Product Name | Putty Pro |
| Manufacturer SKU | TG-P-P-030-R |
| MPN | TG-P-P-030 |
| EAN Code | 4260711991189 |
| Performance Characteristics | |
| Thermal Conductivity Tier | Pro (Very High Thermal Conductivity) |
| Electrical Conductivity | Electrically Non-Conductive |
| Primary Function | Replacement for conventional thermal pads; Flexible gap filler |
| Heat Transfer Level | Optimized for high-performance GPU modifications and professional cooling solutions |
| Physical Properties | |
| Package Content weight | 30 Grams |
| Consistency | Soft, Malleable Putty; Easy-to-apply and flexible |
| Gap Filling Capability | Compensates for significant height differences between PCB and heatsink |
| Application & Yield Estimation | |
| Yield: Smaller GPUs (e.g., GTX 1060) | Approx. 30g container required (No active backplate) |
| Yield: Larger GPUs (e.g., RTX 4090) | Approx. 30g for front-side VRAM and VRM; Approx. 60g (two containers) for full PCB and backplate gaps |
| Ideal Application Targets | GPU Memory (VRAM), Voltage Regulator Modules (VRM), and secondary PCB components |
| Safety & Installation Notes | |
| Prohibited Use Cases | NOT SUITABLE for use on CPU Integrated Heat Spreaders (IHS), Direct Die CPU applications, or directly on the GPU silicon die |
| Surface Preparation | Surfaces must be thoroughly cleaned and degreased using isopropanol or TG Cleaning Wipes prior to application |
| Durability | Engineered for long-term stability and resistance to thermal degradation |
| Packaging Weight | 0.2 kg |
|---|---|
| Packaging Dimensions (L×W×H) | 9 × 8 × 5 cm |
| Brand | Thermal Grizzly |
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