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₱43,200.00Original price was: ₱43,200.00.₱37,650.00Current price is: ₱37,650.00.
Supports AMD Ryzen 9000, 8000, and 7000 Series Processors with the AM5 Socket.
Digital Twin 18+2+2 Phases VRM with 110A Smart Power Stage for elite power stability.
X3D Turbo Mode 2.0 technology provides up to 25% gaming performance increase for Ryzen X3D CPUs.
Supports Ultra-Fast DDR5 memory overclocking speeds up to 9000+ MT/s with D5 Bionic Corsa.
Dual USB4 Type-C ports with 40Gbps bandwidth and DisplayPort-Alt mode functionality.
Cutting-edge Wi-Fi 7 connectivity with 320MHz channel support and ultra-high gain antenna.
Dual Ethernet ports including a massive 10GbE LAN and a secondary 5GbE LAN for extreme networking.
Five M.2 slots including 2x PCIe 5.0 x4 and 3x PCIe 4.0 x4 connectors with Thermal Guard XL heatsinks.
DIY-Friendly Design: PCIe EZ-Latch Plus, M.2 EZ-Flex, and WIFI EZ-Plug for screwless, hassle-free assembly.
Premium White “ICE” Aesthetic with immersive I/O Zone AORUS Lighting.
Front Panel USB-C with 20Gbps speed and 65W Power Delivery (PD 3.0) for fast device charging.
SKU: GA-X870E-A-MASTER-X-ICE
In stock
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For walk-in customers: please always INQUIRE FIRST before visiting as not all items are displayed in our physical store. As an online-first store, most of our inventory is held in our online warehouse and is transferred to the store upon request.
The GIGABYTE X870E AORUS MASTER X3D ICE stands as a pinnacle of motherboard engineering, specifically tailored for enthusiasts seeking the ultimate white-themed aesthetic combined with record-breaking performance. Built on the AMD X870E chipset and featuring the LGA 1718 AM5 socket, this board is optimized to extract every ounce of potential from the latest AMD Ryzen 9000, 8000, and 7000 series processors. The “Icy” design philosophy extends beyond the white PCB and sleek heatsinks, incorporating advanced AI-driven overclocking technologies like X3D Turbo Mode 2.0. This exclusive BIOS innovation enables users to boost gaming performance by up to 25 percent with a single click, making it the definitive platform for 3D V-Cache enabled CPUs.
Power delivery is handled by a massive digital twin 18+2+2 phase VRM solution utilizing 110A Smart Power Stages, ensuring that even under extreme overclocking scenarios, voltage remains rock-steady. This robust power stage is cooled by the VRM Thermal Armor Advanced system, which features a direct-touch heatpipe and high-efficiency 12 W/mK thermal pads to dissipate heat rapidly. The 8-layer server-grade PCB further enhances signal integrity, allowing for unprecedented memory speeds of DDR5-9000 and beyond. This is supported by D5 Bionic Corsa, an AI-enhanced signal optimization technology that reduces latency and maximizes data throughput for professional-grade stability.
Connectivity on the X870E AORUS MASTER X3D ICE is equally impressive, boasting dual USB4 Type-C ports capable of 40Gbps speeds and high-resolution DisplayPort-Alt outputs. Networking is dominated by a dual LAN setup featuring 10GbE and 5GbE ports, alongside the cutting-edge Wi-Fi 7 standard which supports 320MHz channels for wireless speeds that rival traditional wired connections. Storage enthusiasts will find five M.2 slots, including two dedicated PCIe 5.0 sockets for next-generation NVMe SSDs, all protected by GIGABYTE’s M.2 Thermal Guard XL heatsinks to prevent thermal throttling. For builders, the DIY-friendly design includes EZ-Latch Plus for toolless GPU removal and M.2 EZ-Flex for screwless SSD installation, ensuring a seamless and high-end assembly experience.
Technical Specifications
Detailed Details
Product Name
X870E AORUS MASTER X3D ICE
Model / SKU
GA-X870E-A-MASTER-X-ICE
CPU Socket
AMD Socket AM5 (LGA 1718)
Processor Support
AMD Ryzen 9000, 8000, and 7000 Series Processors (Supports Future-Gen AM5)
Chipset
Dual Chipset AMD X870E
Memory Technology
4 x DDR5 DIMM Sockets; Up to 256GB Capacity; Dual Channel Architecture
Memory Speed
Supports DDR5 9000+(OC) MT/s; AMD EXPO and Intel XMP Support
VRM Power Design
Digital Twin 18+2+2 Phases (110A Smart Power Stage); 9+9 Parallel Power Design
PCB Engineering
8-Layer Server-Grade PCB; 2X Copper Enhancement; Low-Loss/Mid-Loss Construction
PCIe Expansion Slots
1 x PCIe 5.0 x16 (PCIEX16); 1 x PCIe 5.0 x16 (run x8); 1 x PCIe 4.0 x16 (run x4)
M.2 Storage Slots
Total 5 Sockets: 2 x M.2 PCIe 5.0 x4/x2; 3 x M.2 PCIe 4.0 x4/x2
SATA Connectors
2 x SATA 6Gb/s Ports
USB Connectivity (Rear)
2 x USB4 Type-C (40Gbps); 1 x USB 3.2 Gen 2x2 Type-C; 1 x USB 3.2 Gen 2 Type-C; 7 x USB 3.2 Gen 2 Type-A
USB Connectivity (Front)
1 x USB Type-C (3.2 Gen 2x2 with 65W PD 3.0/QC 4+); 4 x USB 3.2 Gen 1; 4 x USB 2.0/1.1
Wired Networking
Dual LAN: 10GbE LAN + 5GbE LAN
Wireless Connectivity
Wi-Fi 7 (802.11be); 320MHz Bandwidth; Bluetooth 5.4; Ultra-High Gain Antenna
Audio Hardware
Realtek ALC1220 Codec; ESS ES9118 DAC; DTS:X Ultra Support
Graphics Outputs
1 x HDMI 2.1 (Rear); 1 x HDMI 1.4 (Internal Front Link); 2 x USB4 Type-C (DP-Alt Mode)
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