HIKSEMI ARMOR 16GB DDR4 3200MHz UDIMM Desktop Gaming Memory – HSC416U32D2 16G
Original price was: ₱7,260.00.₱6,320.00Current price is: ₱6,320.00.
- SKU: HSC416U32D2 16G
- High-Speed 3200MHz Operation: Greatly improves system agility, frame rates, and application load times.
- Massive 16GB Capacity: A single-module solution that delivers smooth multitasking and future-proof headroom.
- Intel XMP 2.0 Ready: Enables simple, one-click overclocking for instant performance gains.
- Broad Platform Compatibility: Works flawlessly out of the box with modern Intel and AMD DDR4 motherboards.
- Advanced Thermal Design: Features a rugged matte-black heat-spreader for maximum stability under heavy loads.
- Low-Profile Form Factor: Just 31.25mm tall, ensuring maximum compatibility with bulky aftermarket CPU coolers.
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Uncompromising Performance for Demanding Workloads
The HIKSEMI ARMOR 16GB DDR4 3200MHz U-DIMM is masterfully engineered to be the ultimate memory upgrade for passionate gamers, content creators, and power-users. By operating at an impressive 3200 MHz frequency, this memory module significantly enhances data throughput and eliminates system bottlenecks. This translates to an incredibly agile desktop experience, providing smoother frame rates in demanding AAA gaming titles and vastly reducing load times during heavy multitasking workflows or 3D rendering projects.
Seamless Overclocking and Universal Compatibility
Achieving peak performance has never been more straightforward. The HIKSEMI ARMOR module is fully Intel XMP 2.0 ready, allowing users to effortlessly activate high-speed factory profiles with a single click in their motherboard’s BIOS. Furthermore, this memory stick boasts extensive compatibility across both modern Intel and AMD desktop platforms that support DDR4 technology. This versatility ensures that whether you are upgrading an existing rig or building a completely new professional workstation, the ARMOR memory will integrate flawlessly and operate with unyielding stability.
Superior Thermal Design and Build Quality
Constructed using meticulously selected IC chips, the HIKSEMI ARMOR memory embodies a design philosophy centered on simplicity and unwavering reliability. Enveloping the high-quality PCB is a rugged, matte-black heat-spreader that is designed to aggressively dissipate thermal buildup during continuous, heavy-load operations. The low-profile height of just 31.25 mm ensures that this RAM will easily clear the vast majority of popular aftermarket CPU coolers, making installation entirely hassle-free.
Sleek Aesthetics for Any PC Build
Designed to complement rather than overpower your system’s aesthetic, the discrete matte-black thermal shield and understated branding of the ARMOR series fit perfectly into any setup. It provides a stealthy, professional look that seamlessly blends into minimalist workstations while maintaining enough edge to look right at home inside a fully illuminated, RGB-heavy gaming rig. It is the perfect blend of subtle visual quality and unapologetic computational power.
| HIKSEMI ARMOR 16GB DDR4-3200 UDIMM Specifications | |
|---|---|
| General Information | |
| Brand | HIKSEMI |
| Model Series | HS-UDIMM-ARMOR (U10 series) |
| SKU | HSC416U32D2 16G |
| Capacity | 16 GB (Single Module) |
| Performance & Interface | |
| Memory Type | DDR4 |
| Form Factor | U-DIMM (Unbuffered DIMM) |
| Pin Count | 288-pin |
| Operating Frequency | 3200 MHz |
| CAS Latency | CL-18 (typical) |
| Operating Voltage | 1.35 V |
| Features & Compatibility | |
| Platform Compatibility | Broad support for modern Intel & AMD DDR4 platforms |
| Overclocking Profile | Intel XMP 2.0 Ready (One-click overclocking) |
| Heat Spreader | Rugged matte-black thermal shield |
| Physical & Technical Specifications | |
| Dimensions (L x W x H) | 133.25 x 31.25 x 1.4 mm |
| Operating Temperature | 0 °C to 85 °C (32 °F to 185 °F) |
| Weight | ≈ 15 g |
| Packaging Weight | 0.3 kg |
|---|---|
| Packaging Dimensions (L×W×H) | 18 × 9 × 4 cm |
| Brand | Hiksemi |
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